# WIA-SEMI-003 - Phase 1: Device Specification Data Structures

**Version:** 1.0.0  
**Status:** Active  
**Last Updated:** 2025-12-26

---

## 1. Overview

Phase 1 of the WIA Power Semiconductor Standard (SEMI-003) defines device specification data structures for power electronic devices including IGBTs, MOSFETs, SiC, and GaN devices. This specification ensures interoperability, reduces integration complexity, and accelerates adoption of advanced power semiconductor technologies across automotive, industrial, and renewable energy applications.

### 1.1 Scope

This phase covers:
- Standardized data structures for device characteristics
- JSON schema definitions and validation rules
- Integration interfaces with simulation and design tools
- Version management and backward compatibility
- Certification and conformance testing requirements

### 1.2 Normative References

- WIA-CORE-001: Core Data Types and Schemas
- WIA-CERT-001: Certification and Compliance Framework
- IEEE 1800.2: Universal Verification Methodology (UVM)
- IEC 60747: Semiconductor Devices Standards
- ISO/IEC 27001: Information Security Management

---

## 2. Data Format Specification

### 2.1 Device Metadata

All power semiconductor devices must provide metadata in standardized JSON format:

```json
{
  "standardId": "WIA-SEMI-003",
  "version": "1.0.0",
  "deviceId": "MANUFACTURER-PARTNUMBER-REVISION",
  "manufacturer": {
    "name": "Manufacturer Name",
    "registryId": "WIA-MFG-XXXXX",
    "contact": "standards@manufacturer.com"
  },
  "deviceType": "SiC_MOSFET",
  "packageType": "TO-247-4",
  "certificationLevel": 3,
  "certificationDate": "2025-06-15",
  "datasheet": "https://manufacturer.com/datasheets/partnumber.pdf"
}
```

### 2.2 Electrical Characteristics

Electrical parameters must include:

#### Voltage Ratings
- Drain-Source Voltage (V_DSS) or Collector-Emitter Voltage (V_CES)
- Gate-Source Voltage (V_GSS) or Gate-Emitter Voltage (V_GES)
- Breakdown voltage characteristics
- Safe operating area (SOA) boundaries

```json
{
  "voltageRatings": {
    "vds_max": {
      "value": 1200,
      "unit": "V",
      "testConditions": {
        "temperature": 25,
        "temperatureUnit": "°C",
        "gateVoltage": 0,
        "testStandard": "IEC 60747-8"
      }
    },
    "vgs_max": {
      "value": 25,
      "unit": "V",
      "polarity": "±"
    }
  }
}
```

#### Current Ratings
- Continuous drain/collector current
- Pulsed current capability
- Temperature derating curves
- Avalanche current ratings

#### On-State Characteristics
- RDS(on) for MOSFETs or VCE(sat) for IGBTs
- Temperature coefficient
- Current dependency
- Gate voltage dependency

### 2.3 Thermal Characteristics

Thermal data must include transient and steady-state impedance:

```json
{
  "thermalImpedance": {
    "junctionToCase": {
      "steadyState": {
        "value": 0.35,
        "unit": "°C/W",
        "testStandard": "JESD51-1"
      },
      "transient": {
        "model": "Foster",
        "parameters": [
          {"R": 0.05, "tau": 0.001},
          {"R": 0.12, "tau": 0.01},
          {"R": 0.18, "tau": 0.1}
        ]
      }
    },
    "junctionToAmbient": {
      "value": 40,
      "unit": "°C/W",
      "testConditions": "Still air, PCB mounted"
    }
  },
  "maxJunctionTemperature": {
    "value": 175,
    "unit": "°C"
  }
}
```

### 2.4 Switching Characteristics

Dynamic switching parameters including:

```json
{
  "switchingCharacteristics": {
    "turnOnTime": {
      "value": 25,
      "unit": "ns",
      "testConditions": {
        "vds": 600,
        "id": 50,
        "vgs": 15,
        "rg": 10,
        "temperature": 25
      }
    },
    "turnOffTime": {
      "value": 45,
      "unit": "ns",
      "testConditions": "same as turnOnTime"
    },
    "switchingEnergy": {
      "turnOn": {
        "value": 0.35,
        "unit": "mJ"
      },
      "turnOff": {
        "value": 0.42,
        "unit": "mJ"
      }
    }
  }
}
```

---

## 3. API Interface Specification (Phase 1)

### 3.1 RESTful Endpoints

Power modules implementing API support must expose the following endpoints:

#### Device Information
```
GET /api/v1/device/info
Response: Complete device metadata and capabilities
```

#### Real-Time Monitoring
```
GET /api/v1/telemetry/current
Response: Current operational parameters (temperature, current, voltage)
```

#### Historical Data
```
GET /api/v1/telemetry/history?start=<timestamp>&end=<timestamp>&interval=<seconds>
Response: Time-series data for specified period
```

### 3.2 WebSocket Streaming

Real-time data streaming via WebSocket:

```
WS /api/v1/stream
{
  "subscribe": ["temperature", "current", "voltage"],
  "sampleRate": 1000  // Hz
}
```

### 3.3 Authentication

All API access requires OAuth 2.0 authentication with device-specific client credentials.

---

## 4. Integration Patterns

### 4.1 Simulation Tool Integration

Standardized SPICE models provided in formats:
- LTspice (.asc, .lib)
- HSPICE (.sp, .lib)
- PLECS (.xml)
- MATLAB/Simulink (.slx)

### 4.2 Design Tool Integration

CAD library packages including:
- Schematic symbols
- PCB footprints  
- 3D STEP models
- Thermal models

---

## 5. Conformance Testing

### 5.1 Mandatory Tests

Devices must pass all mandatory conformance tests:

| Test ID | Description | Pass Criteria |
|---------|-------------|---------------|
| SEMI-003-P1-001 | Schema validation | 100% schema compliance |
| SEMI-003-P1-002 | Data completeness | All mandatory fields present |
| SEMI-003-P1-003 | Value range validation | Within specified bounds |
| SEMI-003-P1-004 | Unit consistency | Correct SI units |
| SEMI-003-P1-005 | Cross-validation | Internal consistency |

### 5.2 Optional Tests

Optional feature tests for advanced capabilities:
- Extended temperature range data
- Advanced thermal modeling
- Multi-chip module coordination
- Predictive maintenance integration

---

## 6. Security Requirements

### 6.1 Data Integrity

All device data must be cryptographically signed:
- RSA-4096 or ECDSA P-384 signatures
- SHA-256 hash verification
- Certificate chain validation

### 6.2 Firmware Authentication

Firmware updates require:
- Code signing with manufacturer key
- Secure boot verification
- Rollback protection

---

## 7. Version Management

### 7.1 Semantic Versioning

Standard uses semantic versioning: MAJOR.MINOR.PATCH
- MAJOR: Incompatible API changes
- MINOR: Backward-compatible additions
- PATCH: Backward-compatible fixes

### 7.2 Deprecation Policy

Features deprecated with 18-month notice period minimum.

---

## 8. Certification Process

### 8.1 Self-Certification

Manufacturers can self-certify Level 1 compliance using WIA validation tools.

### 8.2 Laboratory Certification

Levels 2-4 require testing at WIA-accredited laboratories:
- Comprehensive test execution
- Security audit
- Interoperability validation
- Documentation review

### 8.3 Certification Validity

Certificates valid for 36 months with annual surveillance audits.

---

## 9. Implementation Timeline

Recommended implementation schedule:

| Milestone | Target Date | Deliverables |
|-----------|-------------|--------------|
| Specification Study | Week 1-2 | Requirements analysis |
| Data Structure Implementation | Week 3-6 | JSON schema compliance |
| API Development | Week 7-12 | Endpoint implementation |
| Testing | Week 13-16 | Conformance validation |
| Certification | Week 17-20 | Laboratory testing |
| Production | Week 21+ | Certified devices |

---

## 10. Support and Resources

### 10.1 Reference Implementations

WIA provides reference implementations:
- C/C++ libraries
- Python SDK
- JavaScript/TypeScript packages
- Example device profiles

### 10.2 Validation Tools

Automated validation tools available:
- JSON schema validators
- API test clients
- Security scanners
- Conformance test suites

### 10.3 Community Support

- WIA Standards Forum: https://forum.wiastandards.com
- Technical Support: support@wiastandards.com
- GitHub Repository: https://github.com/WIA-Official/wia-semi-003

---

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